Model |
T-3010a |
測量原理 Measurement Principle |
3D 白光 PSLM PMP (可編程結構光柵相位調製輪廓測量技術,俗稱摩爾條紋技術)
3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology) |
測量項目 Measurements |
體積,面積,高度,XY偏移,形狀 (volume,acreage,height, XY offset, shape ) |
檢測不良類型 Detection of Non – Performing Types |
漏印,少錫,多錫,連錫,偏移,形狀不良
(missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) |
相機像素 Camera Pixel |
2M( 4M as optipon) |
視野尺寸 FOV Size |
26 X 20mm |
精度 Accuracy |
XY方向 (XY direction):10um;高度(height):0.37um |
重復精度 Repeatability |
高度:小於1um (4 Sigma);體積/面積:小於1%(5 Sigma)
(height:<1um (4 Sigma);volume/acreage:<1%(5 Sigma)) |
檢測重復性 Gage R&R |
遠遠小於10% far less than 10% |
檢測速度 Inspection Speed |
0.5sec/FOV |
檢測頭數量 Quantity of Inspection Head |
Single Head (Twin-Heads as optipon) |
基準點檢測時間 Mark-point Detection Time |
0.5 sec/piece |
最大檢測高度 Maximun Meauring Height |
±350um (±1200um * as optipon) |
彎曲PCB最大測量高度 Maximun Measuring Height of PCB Warp |
±2mm |
最小焊盤間距 Minimum Pad Spacing |
100um (焊盤高度為150um的焊盤為基準 pad height of 150um as the reference) |
最小測量大小 Smallest Measuring Size |
長方形(rectangle):150um;圓形(round):200um |
最大PCB載板尺寸 Maximum Loading PCB Size |
X700 x Y600 mm
(1000 x 600mm as optipon) |
定動軌設置 Fixed or Flexible Orbit Setting |
前定軌front orbit |